A lot of things are happening here.

The technology is constantly moving. Wireless communication, in particular, seems to show outstanding innovation every two or three months!! home automation is advancing, the medical community is more active than ever and green energy is on everyones mind … How far can we go ?

The main objective of EASii IC is to always be at the forefront of innovation

To help you keep up, we are providing you with up to date news about EASii IC.

Latest news

MAY 2021


On May 27th will take place Minalogic’s Business Meetings on the « Région du Numérique » campus in Lyon and online !

It will be a day of international meetings that will allow EASii IC to bring new collaborations to life and speed up its development.

We wish to thank Minalogic, our partner, for the organization of this event.

More informations, here

MARCH 2021


From 15 to 17 of march, EASii IC will take part in the fifth edition of the A&DSS Summit that will take place entirely online.

For 3 days, more than 800 companies from 35 different countries will be able to meet and create premium professional relationships.

For us, it will be an opportunity to meet prospective industrial partners and to demonstrate our expertise in the conception of electronic systems and integrated circuits for aeronautics and space applications.

Our presence is endorsed by the Auvergne Rhône-Alpes region, which we are proud to represent

More informations, here

JULY 2020


EASii IC proves its expertise in the aeronautical field through validation of its EN9100 certification.

It is the consecration of several months of work for all the teams and a validation of our skills.

Thanks to this new certification, EASii IC is getting ready for exciting new opportunities.

More informations, here

JUNE 2019

CoaXPress workgroup has released the new 2.0 version of the standard, in which EASii IC has been involved. The major new feature is the speed doubling up to 12.5Gbps per lane for downlinks and 41Mbps for uplinks.

Right now EASii IC provides a full set of reference designs using its CXP Device 2.0 IP core and last generation of FMC CXP-DEV-12G boards. 100Gbps using 8 lanes has never been so easy to achieve.


More informations, here


EASii IC will exhibit at VISION 2018 taking place in Stuttgart from 6th to 8th November 2018.

On this occasion, EASii IC will present its IP CXP v2.0 and its FMC CXP Host and Device boards.

The Aeronautics Division ADiiS will reveal its brand new camera : a CXP HDR ultra-small cube camera.

JULY 2018

EASii IC, the innovative SoC & ASIC design house has become an Arm Approved Design Partner.

To receive Arm Approved Design Partner accreditation, EASii IC successfully completed the Arm auditing process. This accreditation validates EASii IC’s ability to respond to the increasing requirements for Arm®-based solutions and expertise, from new technologies like IoT, Deep Learning, and Artificial Intelligence. “Becoming an Arm Approved Design Partner is an essential step in the recognition of our design skills and our commitment to quality,” said Yannick Thépaut, EASii IC’s CEO. Over the past 15 years of creating innovative SoC & ASIC for demanding markets such as aerospace & defense, consumer, industrial, mobile phone and medical, EASii IC has developed a robust design flow using best-performing EDA solutions, and has built up a library of analog IP that complements Arm core IP, allowing them to rapidly design custom ASIC. “The Arm Approved Design Partner program gives an assurance that EASii IC have been through rigorous testing and know how to implement Arm IP in the most effective and efficient way possible,” said Peter Lewin, marketing director, Partner Enablement Group, Arm. “This enables EASii IC to provide more customers with a low-risk solution, from specification to chip supply, allowing them to achieve rapid time-to-market.”


JUNE 2018

EASii IC obtained the renewal of its Research Accreditation for the years 2018, 2019, 2020, 2021 and 2022.

More informations here

JUNE 2018

EASii IC will present at ARM’s seminar on June 27th, 2018, in Palaiseau (Paris) to help you get a custom chip from concept to production.

More information on


Find us on "Présences", a monthly magazine published by the Grenoble Chamber of Commerce and Industry.

For more information, visit

Download publication


EASii IC will be present at DeciElec.

For more information, visit

MARCH 2017

EASii IC will be present at MtoM & Objets Connectés 2017 in Paris (22 to 23 March).

For more information, visit


EASii IC is certified ISO 9001:2015 from LCIE Bureau Veritas.

This certification recognizes that the policies, procedures and practices in EASii IC’s Quality Management System ensure consistent and high quality in the services and products we provide to our customers.

Download Certificate


EASii IC is attending to SEMICON Europa 2016, from October 25th to October 27th, in Alpexpo Grenoble.

This major event for semiconductor industry is gathering 7000 visitors and 500 exhibitors .

Co-location with IoT Planet offers visitors the unique opportunity to visit and meet the full electronic value chain, from core silicon technology to software, final applications and connected objects.

For more information, visit and


EASii IC is attending to "Connect PME" forum, on September 14th, in Crolles.

"Connect PME" forum is dedicated to SMEs/SMIs from Rhône-Alpes and to STMicroelectronics (Grenoble–Crolles) trainees having internship ending in 2016.

This forum is the result of strong partnership started 4 years ago with Minalogic and "Pacte PME", and enhances the solidarity between corporate groups and SMEs/SMIs by allowing immediate hiring of new talents.

For more information, visit

JUNE 2016

DAC 2016 : Tuesday, June 7, from 4-6 p.m. DAC Show floor, SI2 Pavilion, #239

The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems embedded software and Intellectual Property (IP) .

Austin Convention Center : 7 French SME (Minalogic partners including MODELiiS) will be introduced


EASii IC participates in ForumLED Expo 2015 in Lyon, France and presents its latest AC LED Driver.

Meet us at booth number C38

JULY 2015

X-Rel Semiconductor, EASii IC Spin Off, participate to high temperature Electronics Network Conference ( Hiten). Cambridge ,UK 6 to 8 July 2015

MAY 2015

X-Rel Semiconductor, EASii IC Spin Off, is to participate in Offshore Technology Conference (Houston,USA 4 to 7 May 2015)


MARCH 2015

EASii IC is mentioned in an article in the Electronics journal concerning the collaborative project Mistral led by our Partner DelfMems. EASii IC is involved in the design of the RF MEMS switch Driver.

JULY 2015

EASii IC and ADiiS division will be at the ILA conference - Berlin Air Show from 20 to 25 May 2014.

MAY 2014

Hitec sponsor, the inernational conference and exibition on high temperature components via the X-Rrel Semiconductor spin Off of EASii IC design High temperature Devices .(From May 13 to 15 In albuquerque -USA)


EASii IC is participating to 'NIDAYS' Conference organized february the 11 at Paris. This show will be the oportunity to present the toolkit ICÔNE, automatic model tools, the most powerfull of the market, integrated in Labview sofware environment.


EASii IC was present at 'DSP Valley Multi-B2B' conference, organized october 22 in Belgium. The main objective was to enable high tech companies to meet together in the form of thirtyminutes interviews. Read the testimony of Jerome Boudonnet - EASii IC

JULY 2013

HiTEN sponsor, the international conference and exibition on high temperature components via the X-Rel Semiconductor Spin Off of EASii IC design High temperature Devices.(From July 8 to 1O In OXFORD -UK)

JUNE 2013

PME Pact -TV Report-19/20 France 3 Alps-06/28/2013- EASii IC presentation

JUNE 2013

EASii IC and its divisions ADiiS & X-Rel Semiconductor will be present at the Paris Air Show (Bourget) on the collective stand Pegasus. Come to discover our camera and recoder qualified for aerospace. As a preview Asiis will present its latest HD camera (Paris June 17 to 23 ,2013)

MAY 2013


X-Rel Semiconductor, the Spin Off of EASii IC, will be present at the International Congress and Exhibition for power electronics in Nuremberg (Germany) from 14 to 16 May 2013.

MAY 2013

OTC Show

X-Rel Semiconductor, the Spin Off of EASii IC will be present at this great event for offshore technologies to be held in Houston (Texas) from 6 to 9 May 2013.


ILA show, ADiiS EASii IC Division will be present at this great event of the international aviation to be held in Berlin from Tuesday 11 to Sunday, September 16, 2012.

JUNE 2012

Eurosatory Show, ADiiS EASii IC Division is pleased to present its new products (4 channels Video Recorder and Cockpit cameras or external qualified DO160) at the International Exhibition of Defence and Security of the land to be held in paris Monday June 11 to Friday, June 15, 2012.

MAY 2012

HiTec International Conference on High Temperature Electronics, in May 2012, United States, EASii IC is present at the International Conference on High Temperature Electronics (HiTec 2012) from 8 to 10 May 2012 in Albuquerque, New Mexico, USA.

MARCH 2012

EASii IC obtained the renewal of its Research Accreditation for the years 2012, 2013 and 2014 on the FUI/Minalogic project SHIVA.


Polytech Sophia: SystemVerilog Training, UVM for verification and Introduction to functional verification


The GIF welcomes 150 unpublished European technologies, innovative and selected by a committee of experts More than 1,500 people from all over Europe to participate in GIF :

- Develope there innovation network
- Identify any collaboration opportunities
- Discover unsuspected innovation sources

JULY 2011

Sponsor Hiten (USA), the international conference and exhibition on the High Temperatures components via the X-Rel Semiconductor Spin Off of EASii IC design High Temperature circuit (from 18 to 20 July in Oxford - UK).

JUNE 2011

CAP'TRONIC exibition: How to innovate and integrate electronic functions into systems for the Nuclear Market. EASII IC participated with the presentation on the effects of radiation on electronics by D.GAUTHIER (EASii IC).

MARCH 2011

Newsdate (Grenoble): EASii IC offers solutions on the Soft Error and validation of IC's.


Polytech Sophia: Training System Verilog for verification


Polytech Sophia: Introductiontraining in functional verification


S4D (Southampton,UK): EASii IC presents: System, Software, SoC and Silicon Debug

MAY 2010

CDNLive (Munich): EASii IC presents a methodology of co-firmware verification of processor-based control systems.

MAY 2010

EASii IC becomes a member of "Questa Vanguard Program" Mentor Graphics and provides expertise SystemVerilog / OVM

APRIL 2010

EASii IC and Breker Verification Systems collaborate on the comprehensive test generation for system verification and IP